24-Pin SOIC-to-22-Pin 0.400" DIP
FEATURES * A cost-effective means of upgrading to SOIC without changing your PCB layout. GENERAL SPECIFICATIONS * BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides * PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M * PIN PLATING: 200 [5.08] Sn/Pb 93/7 per ASTM B579-73 over 100 [2.54] Ni per SAE AMS-QQ-N-290 * OPERATING TEMPERATURE: 221F [105C] MOUNTING CONSIDERATIONS * SUGGESTED PCB HOLE SIZE: 0.028 0.003 [0.710.08] dia.
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice.
ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: 0.005 [0.13] UNLESS OTHERWISE SPECIFIED PINS 11 AND 14 NOT CONNECTED ON SOIC CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
ORDERING INFORMATION 22-304504-18-P
Optional Panelized Version
Bristol, PA 19007-6810 USA TEL (215) 781-9956 * FAX (215) 781-9845 WWW.ARIESELEC.COM * INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18080 Rev. AB
|
